Qualcomm WCN3990 Wireless Combo SoC Basic Functional Analysis

Product Code
FAR-1706-801
Release Date
13/07/2017
Availability
Published
Product Item Code
QUA-WCN3990
Device Manufacturer
Qualcomm
Device Type
WLAN
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Floorplan Analysis
Report Code
FAR-1706-801
This report presents a Basic Functional Analysis of the Qualcomm QUA-V5AM68 die found inside the Qualcomm WCN3990 wireless combo SoC. The component was extracted from the Xiaomi Tech Xia-Mi6 multi-band handset.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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