Product Code
BFR-2103-805
Availability
Published
Product Item Code
UC1-UWP5882
Device Manufacturer
Unisoc
Device Type
Bluetooth
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Transceiver Floorplan
Report Code
BFR-2103-805
Image
This report presents a Basic Floorplan Analysis of the UWP5882 Bluetooth 5.0 audio system-on-chip (SoC) found inside the UNISOC UWP5882 (IVY5882) package.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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