Product Code
Release Date
Product Item Code
Device Manufacturer
Espressif Systems
Device Type
Evaluation Kit
IoT Connectivity SoC
IoT Connectivity SoC - Transceiver Floorplan
Espressif ESP32-C3 Wi-Fi/BT Basic Floorplan
This report presents a Basic Floorplan Analysis of the Espressif ESP32-C3 wireless combo SoC die found inside the Espressif ESP32-C3F component. The ESP32-C3 comprises a RISC-V single core CPU with support for 2.4 GHz Wi-Fi and Bluetooth low energy. The Espressif ESP32-C3F was extracted from the Espressif ESP32-C3-DevKitM-1 development kit. This report presents a Basic Floorplan Analysis of the Qualcomm HG11-YC990-110 die found inside the Murata 1XE wireless module.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process

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