
Product Code
BFR-2103-801
Availability
Published
Product Item Code
ESP-ESP32-C3-DEVKITM-1
Device Manufacturer
Espressif Systems
Device Type
Evaluation Kit
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Transceiver Floorplan
Espressif ESP32-C3 Wi-Fi/BT Basic Floorplan
This report presents a Basic Floorplan Analysis of the Espressif ESP32-C3 wireless combo SoC die found inside the Espressif ESP32-C3F component. The ESP32-C3 comprises a RISC-V single core CPU with support for 2.4 GHz Wi-Fi and Bluetooth low energy. The Espressif ESP32-C3F was extracted from the Espressif ESP32-C3-DevKitM-1 development kit. This report presents a Basic Floorplan Analysis of the Qualcomm HG11-YC990-110 die found inside the Murata 1XE wireless module.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
Sign up for latest analysis, news and insights from TechInsights!
Stay informed about TechInsights’ products, services, and events. Email collection adheres to TechInsights’ Privacy Policy.
Revealing the innovations others cannot inside advanced technology products
Contact
General Inquiries
1-888-666-8888
1891 Robertson Rd #500, Nepean, ON K2H 5B7
Copyright © 2023 TechInsights Inc. All rights reserved.