Product Code
BFR-2103-801
Availability
Published
Product Item Code
ESP-ESP32-C3-DEVKITM-1
Device Manufacturer
Espressif Systems
Device Type
Evaluation Kit
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Transceiver Floorplan
Report Code
BFR-2103-801
Image
This report presents a Basic Floorplan Analysis of the Espressif ESP32-C3 wireless combo SoC die found inside the Espressif ESP32-C3F component. The ESP32-C3 comprises a RISC-V single core CPU with support for 2.4 GHz Wi-Fi and Bluetooth low energy. The Espressif ESP32-C3F was extracted from the Espressif ESP32-C3-DevKitM-1 development kit. This report presents a Basic Floorplan Analysis of the Qualcomm HG11-YC990-110 die found inside the Murata 1XE wireless module.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
A unique vault of trusted, accurate data at your fingertips
Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.