Realtek RTL8773 Bluetooth 5.0 Basic Floorplan Report

Product Code
BFR-2103-806
Release Date
03/09/2021
Availability
Published
Product Item Code
REB-RTL8773BFR
Device Manufacturer
Realtek
Device Type
Bluetooth
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Floorplan Analysis
Report Code
BFR-2103-806
This report presents a Basic Floorplan Analysis of the RL6600C die found inside the Realtek RTL8773BFR SoC component. The RTL8773BFR was extracted from the Realtek RTL8773BFR Evaluation Board.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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