Product Code
BFR-2103-804
Availability
Published
Product Item Code
GDX-GR5515
Device Manufacturer
Goodix
Device Type
SoC (System-on-Chip)
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Transceiver Floorplan
Report Code
BFR-2103-804
Image
This report presents a Basic Floorplan Analysis of the Goodix GX101 die found inside the Goodix GR5515RGBC system-on-chip (SoC) component.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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