UNISOC UMW2651 Wireless Combo SoC Basic Floorplan Analysis

Product Code
BFR-2009-801
Release Date
16/10/2020
Availability
Published
Product Item Code
SPR-UMW2651
Device Manufacturer
SPREADTRUM
Device Type
WiFi SoC
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Functional Analysis
Report Code
BFR-2009-801
This report presents a Basic Floorplan Analysis of the UMW2651 wireless combo SoC found inside the UNISOC UMW2651 (IVY2651) component. The UNISOC UMW2651 was extracted from the Hisense HNR550T smartphone.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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