MediaTek MT2811SP BT 5.0 Audio SoC Basic Floorplan Analysis

Product Code
BFR-2008-801
Release Date
25/09/2020
Availability
Published
Product Item Code
MED-MT2811SP
Device Manufacturer
MediaTek
Device Type
Bluetooth
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Functional Analysis
Report Code
BFR-2008-801
This report presents a Basic Floorplan Analysis of the MediaTek AM10729CW die found inside the MT2811SP component, which was extracted from the Sony WF-1000XM3 wireless stereo headset. This features its own branded Bluetooth Audio SoC TechInsights has observed. It is good to see the competition in the fast-growing TWS wireless headphone market.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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