
Product Code
BFR-2008-801
Availability
Published
Product Item Code
MED-MT2811SP
Device Manufacturer
MediaTek
Device Type
Bluetooth
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Functional Analysis
Report Code
BFR-2008-801
This report presents a Basic Floorplan Analysis of the MediaTek AM10729CW die found inside the MT2811SP component, which was extracted from the Sony WF-1000XM3 wireless stereo headset. This features its own branded Bluetooth Audio SoC TechInsights has observed. It is good to see the competition in the fast-growing TWS wireless headphone market.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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