Product Code
BFR-2001-801
Release Date
Availability
Published
Product Item Code
TLK-TLSR8258
Device Manufacturer
Telink Semiconductor
Device Type
SoC (System-on-Chip)
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Transceiver Floorplan
Telink TLSR8258 BLE 5.0 and 802.15.4 SoC Basic Floorplan Analysis
This report presents a Basic Floorplan Analysis of the Telink TLSR8258 die found inside the Telink TLSR8258F512E48 component. The IoT SoC supports multi IoT standards, including BLE, BLE Mesh, ZigBee, etc. It is torn down from the nVidia Sheild TV and can be used in many different applications.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
 

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