Samsung KLUFG8R1EM-B0C1 64L TLC 3D V-NAND 512 Gb Die Memory Floorplan Analysis

Product Code
MFR-1903-802
Release Date
21/06/2019
Availability
Published
Product Item Code
SAM-KLUFG8R1EM-B0C1
Device Manufacturer
Samsung
Device Type
NAND Flash
Subscription
Memory - NAND & DRAM
Channel
Memory - NAND Functional Analysis
Report Code
MFR-1903-802
This report presents a Memory Floorplan Analysis of the Samsung K9AHGD8U0M die found inside the Samsung KLUFG8R1EM-B0C1 3D V-NAND TLC flash memory package.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Plan-view SEM micrograph of the die delayered to the WL and BL layers
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and diffusion level die photographs delivered in the CircuitVision software
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