Availability
Published
Product Code
MFR-2012-803
Product Item Code
MIC-MT61K512M32KPA-14C_B
Device Manufacturer
Micron Technology
Device Type
GDDR6
Subscription
Memory - NAND & DRAM
Channel
Memory - DRAM Floorplan Analysis
Micron Gen2 1y nm 8 Gb GDDR6 Memory Floorplan Analysis
This report presents a Memory Floorplan Analysis of the Micron Y21G die found inside the Micron MT61K512M32KPA-14C:B.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
The Authoritative Information Platform to the Semiconductor Industry.
