Toshiba TH58LJT0T24BADE 96-Layer 3D NAND Memory Floorplan Analysis

Product Code
MFR-1902-804
Release Date
05/04/2019
Availability
Published
Product Item Code
TOS-TH58LJT0T24BADE
Device Manufacturer
Toshiba
Device Type
NAND Flash
Subscription
Memory - NAND & DRAM
Channel
Memory - NAND Functional Analysis
Report Code
MFR-1902-804
This report presents a Memory Floorplan Analysis of the Toshiba FSTO_256G die found inside the Toshiba TH58LJT0T24BADE 3D NAND flash memory package.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features in the BL and WL directions
  • SEM plan-view micrographs at the middle of the vertical channel level and the BL levels from beveled sample
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon
  • Identification of major functional blocks on a diffusion layer die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and diffusion level die photographs delivered in the CircuitVision software
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