This report presents a Memory Functional Analysis of the SK Hynix H27DGLG die found inside the SK Hynix H28S7Q302BMR-UFS package. The H28S7Q302BMR-UFS was extracted from the Xiaomi Tech Mi 8 smartphone with the model number M1803E1A.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM cross-sectional micrographs of a bevel through the memory array showing the active, BL and WL level plan-view features of the memory array and a cross section through the BL, showing the general structure of the flash cell array, die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to diffusion layer
• Identification of major functional blocks on a diffusion layer die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and diffusion level die photographs delivered in the CircuitVision software