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For leaders who want to base their product road maps on hard facts TechInsights' analysis is the ideal solution. Our subscription-based services offer regular, succinct, and authoritative analysis of state-of-the-art ICs in high-volume and high-growth applications.

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TechInsights provides our extensive technical findings and insights through five, cost-effective subscription services. Each gives you access to our full competitive analysis and will help guide your strategic decisions in a specific area:

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Get the facts you need to make informed decisions on your biggest investments. TechInsights analyzes, summarizes and synthesizes:

Advanced Process & Packaging
Process Flows
Transistor Characterization
Floorplan Analysis
System on Chip (SoC) Design

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This subscription-based service is the authoritative and most cost-effective source of reliable and accurate analysis of image sensors in high-volume and high-growth applications including:

Consumer (smartphones, tablets, & digital cameras)
Professional (digital and video cameras)
Automotive and security
Specialty devices (gaming and industrial)
Emerging growth areas

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TechInsights’ IoT Connectivity SoC subscription product provides tailored technical analysis to help you address the challenges of developing your IoT product strategy.

Provides facts on IoT connectivity SoC and the competitive landscape
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Empowers you to grow market share and revenue
Tailored options provide the analysis you need, when you need it

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Provides the facts you need to make informed decisions on your biggest investments
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TechInsights Memory analyzes, summarizes, and synthesizes:
SSD Teardown & Costing, Mobile Device Teardown & Costing, DRAM Functional Analysis, DRAM Sub Word Line Driver Transistor Characterization, NAND Functional Analysis, Advanced Process & Packaging, Process Flows, Comprehensive Circuit Analysis

Power Semiconductor Subscription

In-depth analysis into cutting-edge Gallium Nitride (GaN), Silicon Carbide (SiC), and Silicon (Si) power semiconductor devices:

Device metrics and salient features
Package x-rays and die photos
SEM plan-view images and cross-sectional SEM images
Cross-sectional TEM images and material analysis

Our primary focus in 2019 will be the consumer applications of GaN technology, where GaN has the potential to replace super junction MOSFET devices in low form factor applications.

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Recent News and Blogs

Recent MediaTek Mobile RF Components and Analysis

MT6303P AN10516CW 2.95 x 1.74 - 180nm Mobile RF architecture is constantly increasing in complexity to support multiple standards, and we are discovering new mobile RF components in virtually every new phone release. At the time of this writing,

15Jan

In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks

How many layers can 3D flash memory stack? Just as skyscrapers cannot be piled up indefinitely, the number of layers of 3D flash memory is also limited.

08Jan

Securing Smart Connected Homes with OTP NVM

The market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly

06Jan

PC technology trends 2020-DRAM and Flash

新年の幕開けに、パーソナルコンピュータのハードウェア技術の動向を占う「PCテクノロジートレンド」をお届けする。

04Jan

Apple Is About to Add a Third OLED Supplier

This deal has been years in the making. China's BOE Technology Group has been angling to supply Apple with OLED displays destined for iPhones since early 2017.

31Dec

Huawei Mate 30 Pro 5G dismantling: sell 6399 yuan complete machine, BOM cost is only 2799 yuan

According to agency analysis, the 4G version is Huawei's first smartphone product without US parts, while the 5G version still uses some American-made components, the proportion is ...

30Dec

Deep dismantling of Huawei Mate30 Pro 5G: more than 2,000 components from Japan

From the BOM table, the estimated price of the whole machine is $ 395.71, equivalent to less than 2800 yuan, of which the main control chip accounts for about 51.9% of the whole machine price.

26Dec

Imaging + Sensing End-of-Year Highlights

Huawei Leads Imaging Chip Area Arms Race, Sony Wins Big with i-ToF, Emergence of Event-Driven Vision Sensors Posted: December 18, 2019 Contributing Authors: Ray Fontaine, Senior Technology Analyst Samsung, Huawei and Apple continue to push more

17Dec

What’s Next For High Bandwidth Memory

Different approaches for breaking down the memory wall.

17Dec

Seoul Semiconductor patent auction analysis reveals a mixed bag of assets

Seoul Semiconductor recently dipped its toes into the sales side of the patent market with an announcement that it will be auctioning off two patent packages – one at the end of this month and the other in January.

12Dec

Power Integrations Scores OEM Design Win with their PowiGaN Technology

Posted: December 12, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Consumer demand for smaller form factor and higher power, plus government efficiency regulations , are driving innovation in the USB adapter market. The USB-C power delivery

12Dec

Toshiba-WD Alliance 3D NAND mass production will use Samsung TCAT process

集微网消息（文/Yuna），据Impress Watch网站报道，东芝在12月8日召开的IEDM会议上声明在3D NAND闪存量产中采用类似于三星TCAT的存储单元结构。

12Dec

Developing a successful licensing program

As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.

25Nov

DRAM Scaling Challenges Grow

More nodes and alternative memories are in the works, but schedules remain murky.

21Nov

Comet Lake for desktop will appear around February 2020? Intel CPU roadmap

TechInsights released a digest report titled “Intel Core i7-1065G7“ Ice Lake ”10 nm 2nd Gen Processor Analysis” on October 31st .

18Nov

Kirin 990 5G core data exposure: 113.31 square millimeters integrated 10.3 billion transistors

Recently, Huawei released its new 5G mobile phone, the Mate 30 5G series. The performance of its Kirin 990 5G SoC is very exciting. Recently, professional chip research institute TechInsights dismantled this commercial 5G integrated SoC chip.

12Nov

The Apple U1 - Delayering the Chip and Its Possibilities

Posted: November 8, 2019 Contributing Authors: Stacy Wegner Figure 1: the Apple U1 UWB chip One of the most intriguing components included in the iPhone 11 is the mystery chip Apple simply labeled as ‘U1.’ TechInsights has been busily analyzing this

08Nov

Huawei Mate 30 Pro 5G Teardown

Introducing the Kirin 990 5G Posted: November 7, 2019 Contributing Authors: Daniel Yang, Stacy Wegner The Huawei Mate 30 Series is the latest installment of the company’s annual flagship smartphones, released on September 19, 2019 in Munich.

07Nov

TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices

Date: November 6, 2019 / 3:00pm to 4:00pm ET Presented By: Neil MacLeod and Marty Bijman Internal Probing, Waveform Analysis, and More The widespread adoption and expansion of data centers has driven the SSD market to a period of high competition and

06Nov

Intel Core i7-1065G7 “Ice Lake” 10 nm+ Processor Analysis

Intel Core i7-1065G7 “Ice Lake” 10 nm 2nd Gen Processor Analysis

Intel has released their first 10 nm 2 nd Gen processor into consumer products – the Intel Core i7-1065G7 processor, better known as Ice Lake. Dell and Microsoft have already announced the inclusion of Ice Lake in some of their latest offerings. This

31Oct

The Evolution of SiC MOSFET Technology: A Retrospective

Posted: October 31, 2019 Contributing Author: Sinjin Dixon-Warren Silicon carbide (SiC) is a widely used industrial material. Widescale production by the Carborundum Company started in 1893 following the discovery of the Acheson process, which is

31Oct

The Apple iPhone 11, 11 Pro & 11 Pro Max Review: Performance, Battery, & Camera Elevated

TechInsights has now officially released a die shot of the new Apple A13 , and we can confirm a few assumptions on our side.

27Oct

Apple U1 TMKA75 Ultra Wideband (UWB) Chip Analysis

One of the most interesting components from the recently released Apple iPhone 11 line of phones is one that Apple has said very little about; the Apple U1 Ultra Wideband (UWB) chip. So far, Apple has said only that the chip enables directional

24Oct

TechInsights: iPhone 11 Pro Max Cameras Cost $73.5

TechInsights publishes its estimation of Apple iPhone 11 Pro Max components. The cameras appear to be the post expensive part at $73.50.

09Oct

How e-mobility is changing the Automotive

With some TechInsights industry experts, Morahari Reddy and Jianchun Xu, we will analyze the market and focus on different aspects.

07Oct

E-Government - Deep Analysis of Intel Ice Lake: Innovation across Six Pillars

At this year's Taipei Computer Show, Intel introduced the 10th generation Core processor, which is the 10nm process Ice Lake processor.

07Oct

SK hynix 96L 3D PUC NAND Analysis

Among memory manufacturers worldwide SK hynix currently holds the 5th position in NAND Flash market share, with 10.3%. They are the latest to release a 9X-layer NAND solution, with the SK hynix 96L 3D PUC NAND. Development of SK hynix’ 96L 3D PUC

27Sep

Inside the Apple 1720 Charger included with the iPhone 11 Pro Max

Posted: September 27, 2019 Contributing Author: Sinjin Dixon-Warren The iPhone 11 Pro Max ships with the Apple 1720 18 W USB-C power delivery charger. This device is rated to delivery 5 V and 3 A or 9 V and 2 A. In follow up to our recent blog

27Sep

TechInsights Analyses iPhone 11 Cameras

TechInsights publishes a teardown report of the new Apple iPhone 11 Pro Max smartphone with some info on its cameras:

26Sep

Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony

STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.

26Sep

Apple iPhone 11 Pro Max Teardown

Posted: September 23, 2019 - Updated: October 1, 2019 Contributing Authors: Daniel Yang, Stacy Wegner, Albert Cowsky We are always excited to see a new Apple iPhone, and this year’s iPhone 11 line is no exception. This is the first ever Apple event

23Sep

Patent licensing: The patent battleplan

Successful, high-return patent licensing programmes require planning. Peter Hanschke of TechInsights offers a guide to getting it right.

23Sep

Webinar: Preparing to License: Using tools to Scale Your Licensing Program

Originally Presented: September 19, 2019 / 12:00pm to 1:00pm ET Hosted By: Martin Bijman Licensing is a tried and true means to monetize a patent portfolio, but those who will succeed on the path from patent ownership to patent profits will not

19Sep

Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered

Posted: September 17, 2019 With 2018 revenue of $30.4B USD, 16.5% market share in NAND Flash Memory, and 23% market share in DRAM, Micron is one of the biggest players in storage and memory technology. For those looking to support their product

17Sep

How Graphical Solutions Improve 3D NAND Effective Device Density

Driven by Moore's Law, memory and logic chip semiconductor manufacturers reduce product cost and improve performance by increasing transistor density.

16Sep

Webinar: Power Semiconductor – A Market Overview & In-depth SiC and GaN Device Analysis

Previous Broadcast: Tuesday, September 10, 2019 and Tuesday, October 8, 2019 Hosted By: Jianchun Xu and Sinjin Dixon-Warren The power semiconductor market is estimated to reach $32B USD by the end of 2025. Fueled by increasing global demand for more

10Sep

Lithium, the white gold of technology

The price of the mineral collapses, but the batteries continue to consume this white king.

10Sep

Mobile manufacturing: How much do companies earn with the high end?

High-end smartphones have been increasing in price over the years to become unattainable devices for ordinary people.

08Sep

Peloton IPO Preview: All Hype, No Muscle

Peloton, which manufactures and sells premium, large-screen, stationary fitness bikes and treadmills, as well streaming subscriptions for classes aimed at those using the equipment, is expected to go public sometime in the next few months.

03Sep

Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo

Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las

02Sep

A high-end mobile phone sells almost three times what it costs to manufacture it

A mobile phone is sold almost three times more expensive than it costs to manufacture it, taking into account the cost of all the components that make up these devices, from the battery or camera to the operating system that allows applications to

02Sep

Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you

Sunday will be the first round of tariffs. Almost monthly through the end of the year, the government plans to impose additional tariffs on different items.

31Aug

Why I keep writing ’bout holes in the sensor

DPReview's review of the Fujifilm GFX 100 medium format camera shows the consequences of having dead pixels whose space is used for phase detection autofocus (PDAF) modules

31Aug

Deca Technologies Fan-In WLP in Qualcomm PM8150

Posted: August 29, 2019 The fan-In WLP market expected to grow at a steady rate; from $2.9B in 2018 to $4.4B by 2024, at 6.5% CAGR. One of the recent contributors to this market is Deca Technologies, whose M-Series fan-out wafer-level packaging

29Aug

GaN, SiC, and Si technologies in AC Adapters

Posted: August 14, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Introduction AC Adapters are a constant reminder that the mobile devices that we have come to love are not quite as mobile as we would like to think. Every single mobile device

14Aug

Unexpected Design Wins in Huawei Mate 20 X (5G) Teardown

2019 is the year that we have seen the 5G smartphones start to take off. TechInsights posted a blog of the Samsung Galaxy S10 5G teardown in April, which was the world’s first 5G mobile handset in Korea. The Galaxy S10 5G SM-G977N is based on Samsung

02Aug

Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)

4-Part Blog Series: The state of the art of smartphone imagers Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF) Posted: July 30, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image

30Jul

Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)

4-Part Blog Series: The state of the art of smartphone imagers Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI) Posted: July 23, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the

23Jul

Velodyne LiDAR Puck Teardown

Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive

22Jul

Part 2: Pixel Scaling and Scaling Enablers

4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop

16Jul

AC Adapters: GaN, SiC or Si?

Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.

16Jul

Part 1: Chip-stacking and chip-to-chip interconnect

4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect Posted: July 09, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ presentation for the International Image

09Jul

Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU

Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 2019

10Jun

1y DDR4 DRAM from Samsung, SK hynix and Micron

Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was

05Jun

How long can Sony keep the top spot in the image sensor market?

Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.

05Jun

Qualcomm QTM052 mmWave Antenna Module

Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges

31May

NAND technology: Open the gates

In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.

13May

Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign

At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.

02May