Power Semiconductor Subscription

Get regular, succinct analysis of emerging power semiconductor products.

The semiconductor industry is developing new power process technologies using Silicon Carbide (SiC) and Gallium Nitride (GaN) that are smaller and more efficient, with lower losses and higher breakdown voltage.

Silicon (Si) offerings in this space are very mature, but we continue to see noteworthy innovations. This subscription-based service provides you access to our analysis on these cutting-edge products.


TechInsights’ Power subscription products provide insights into emerging power semiconductor products as they enter mass production in high-volume applications.


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Power Semiconductor Subscription

Available Power Semiconductor Subscriptions

Power Essentials

Power Essentials (PEF)

Includes:

  • Annual Target
    • 10 PDF reports with supporting images
  • Analysis Coverage
    • Device metrics and salient features
    • Package x-rays and die photos
    • SEM plan-view images and cross-sectional SEM images
    • Cross-sectional TEM images and material analysis
  • Analyst Curation
    • Tri-annual analyst briefing
    • Annual patent landscape summary
    • Annual workshop
  • Real Time Update
    • Access to project work in progress (PEF report, analyst briefing, etc.) before it is published

 

Silicon Carbide (SiC) Process Flow

Silicon Carbide (SiC) Process Flow

Includes:

  • Process Flow Analysis (PFA)
    • Reports showing process architecture, mask list, and integration-level process steps (target: 4 per year)
  • Process Flow Full Emulation (PFF)
    • Expands upon the detail provided in PFA reports
    • Layout GDS fully decomposed into process layers
    • Provided PDF reports are built using Synopsys Process Explorer
    • Manipulate report data in Synopsys (requires Synopsys license)
    • Process Flow Full Emulation reports with supporting images (target: 4 per year)
  • Analyst
    • Design technology interaction analysis
    • Detailed explanation of process integration from wafer-in through wafer-out
    • Process steps, materials, equipment type, unit process
    • SEM and TEM cross-sectional and top-view images \ Layer annotations, specific process module, assumptions

 

Silicon Carbide (SiC) Floorplan (PFR)

Silicon Carbide (SiC) Floorplan (PFR)

Includes:

  • PDF Report
    • Company Profile
    • Executive Summary
    • Device Identification: Selected teardown photographs (optional), Package photographs, Package X-rays, Die photographs, including die corners and bond pad, and Delayered die photograph
    • Process Analysis: Die edge showing die thickness, Transistor gate array edge or Die Seal, Transistor gate array overview/detail
    • Layout Analysis: Annotated delayered die photograph, Die utilization table
    • Cost Analysis
  • Folders of images
    • Package and Die images
    • SEM Cross Section images
  • CircuitVision enabled top metal and gate level/substrate images
  • 15 reports / year

 

Silicon Carbide (SiC) Floorplan (PFR)

Gallium Nitride (GaN) Floorplan (PFR)

Includes:

  • PDF Report
    • Company Profile
    • Executive Summary
    • Device Identification: Selected teardown photographs (optional), Package photographs, Package X-rays, Die photographs, including die corners and bond pad, and Delayered die photograph
    • Process Analysis: Die edge showing die thickness, Transistor gate array edge or Die Seal, Transistor gate array overview/detail
    • Layout Analysis: Annotated delayered die photograph, Die utilization table
    • Cost Analysis
  • Folders of images
    • Package and Die images
    • SEM Cross Section images
  • CircuitVision enabled top metal and gate level/substrate images
  • 15 reports / year

 

Custom Services

Available Custom Services

  • Product Teardown
    • Power electronics product teardown with detailed analysis
  • Power Process Flow
    • Process flow emulation (process steps, tool type, material)
    • Scope of work addressed on a case-by-case basis; discuss custom options with us
  • Package Analysis
    • Detailed package analysis, cross-sectional package analysis, SEM imaging, SEM-EDS materials analysis
  • Electrical Characterization
    • Transfer characteristics (IDVG), Output characteristics (IDVD), RDSON, Breakdown voltage
  • Selective Area Electron Diffraction
    • TEM-based SAED of the GaN-based epitaxial layers

 

 


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