Huge up-front R&D investment requires customers to have up-to-date and accurate competitive intelligence

Our analysis quantifies the unknown to help you make informed decisions. We can determine what it will cost to bring advanced memory to market, we research potential market challenges to help you determine what your risks are, and we help define your de-risking strategy.

Provides the facts you need to make informed decisions on your biggest investments

Allows you to go to market quicker with best of class products

Empowers you to grow market share and revenue

Tailored Memory analysis to meet your needs

TechInsights Memory offerings have been developed to provide the focused technical intelligence you need based on your industry and role.

Product Brief Download

 

DRAM Functional Analysis (MFR)

Includes:

  • Executive summary supported with image sets
    • Process node and foundry indentification
    • Cricital dimensions
    • Functional block summary
    • Stacked optical top metal and poly die photo delivered in CircuitVision. Includes calibrated measurement and annotions tools
    • SEM cross-sectional and bevel imaging
    • 13-15 reports/year

 

 

DRAM: SWD and Sense Amp Transistor Characterization

Includes:

  • Transitor Characterization Report (TCR)
    • Universal curves for IOFF vs. ION and IOFF vs. ID, LIN derived from
      • 5 NMOS and 5 PMOS sub wordline driver transistors, across multiple VDD at 85°C
      • 5 NMOS and 5 PMOS sense amp transitors, across multiple VDD at 85°C
    • For each universal curve data point
      • Transistor Characteristics: ID, SAT, ID, Lin, Ioff, VT, Lin & VT, SAT, ΔVGS, Gm, SS, DIBL
      • Output Characteristics
  • Analysis Coverage
    • 4 reports/year
    • Trend Analysis
    • 4 hrs support

 

 
 

DRAM Periphery Design (MDP): Sense Amp, Sub Wordline Driver

Includes:

  • Concise analyst's summary of critical device metrics
    • Circuit schematic diagram of sense amplifier
    • Circuit schematic diagram of a sub wordline driver
    • Detailed stacked SEM images of a delayered DRAM sense amplifier and sub wordline driver delivered in CircuitVision. Includes calibrated measurement and annotation tools
    • ~4 reports/year

 

 

DRAM: Circuit Analysis

Includes:

  • Full Circuit Analysis
    • 1 - Memory Array and Peripherals
    • 2 - Address Path
    • 3 - Data Path
    • 4 - Control Blocks, Configuration and Test Block
    • 5 - Voltage Generators System
  • Select Blocks Circuit Analysis
    • 1 - Memory Array and Peripherals
    • 3 - Data Path
    • 5 - Voltage Generators System*
      *Depending upon events and customer interest, TechInsights may produce 1 Select Blocks Circuit Analysis including blocks (1, 3, 5) or 2 Select Blocks Circuit Analysis including blocks (1, 3)
  • Analysis Coverage
    • Full 1/year
    • Select Blocks 1/year

 

 
 

NAND Functional Analysis

Includes:

  • Analysis Coverage
    • Executive summary supported with image sets
      • Process Node and Foundry Identification
      • Critical Dimensions
      • Functional Block Summary
      • Stacked optical top metal and poly die photo delivered in CircutVision which includes calibrated measurement tools
      • SEM cross-sectional imaging
    • 13-15 reports/year

 

 

NAND Periphery Design (MDP): Page Buffer, Wordline Driver

Includes:

  • Concise analyst's summary of critical device metrics
    • Circuit schematic diagram of a page buffer: decoder, switch, and controller
    • Circuit schematic diagram of a wordline driver: decoder and switch
    • Detailed stacked plan view SEM images of a beveled NAND page buffer and worline driver delivered in CircuitVision. CircuitVision includes calibrated measurement and annotation tools
    • ~4 reports/year

 

 
 

NAND: Circuit Analysis

Includes:

  • Full Circuit Analysis
    • 1 - Memory Array and Peripherals
    • 2 - Address Path
    • 3 - Data Path
    • 4 - Control Blocks, Configuration and Test Block
    • 5 - Voltage Generators System
  • Select Blocks Circuit Analysis
    • 1 - Memory Array and Peripherals
    • 3 - Data Path
    • 5 - Voltage Generators System*
      *Depending upon events and customer interest, TechInsights may produce 1 Select Blocks Circuit Analysis including blocks (1, 3, 5) or 2 Select Blocks Circuit Analysis including blocks (1, 3)
  • Analysis Coverage
    • Full 1/year
    • Select Blocks 1/year

 

 

 
 

Advanced Process

Includes:

  • Advanced Memory Essentials (AME)
    • Focused on leading edge NAND and DRAM memory technology
    • Executive summary supported by large image sets
    • SEM cross-sectional and bevel imaging
    • TEM cross-sectional analysis with TEM EDS
    • 8 reports/year
  • Analysis Coverage
    • Technical trend/roadmap by technology element
    • Design technology interaction analysis
    • Detailed explanation of process integrations
    • Next node predictions
    • 3 briefings/year
    • Trend analysis
    • Forecasting
    • 1 annual seminar
    • 4 hrs support

 

 

Process Flows

*Requires Advanced Process Subscription

Includes:

  • Process Flow Analysis (PFA)
    • Spreadsheets showing process, architecture, mask list, and integration-level process steps
    • 8 Memory / year
  • Process Flow Full Emulation (PFF)
    • PFA content may be updated
    • Layout GDS fully decomposed into process layers
    • 3D Emulation
    • Synopsys Input (Route-Level Deck)*
      *Requires Synopsys license to view and modify
    • 6 Memory / year
  • Analysis Coverage
    • Cell Design technology interaction analysis
    • Detailed explanation of process integration from wafer-in through wafer-out
    • Process steps, materials, equipment type, unit process
    • SEM and TEM cross-sectional and top-view images
    • Layer annotations, specific process module, assumption
    • Trend analysis
    • +4 hrs support

 

 
 

Embedded & Emerging Functional Analysis (MFR)

Includes:

  • Analysis Coverage
    • Focused on leading-edge embedded and emerging memory technology
    • Executive summary supported with image sets
    • Process Node and Foundry Identification
    • Critical Dimensions
    • Functional Block Summary
    • Stacked optical top metal and poly die photo delivered in CircuitVisionTM
    • SEM bevel
    • SEM cross-sectional imaging
    • 4 reports/year

 

 

Embedded & Emerging Process Analysis

Includes:

  • Analysis Coverage
    • Focused on leading-edge embedded and emerging memory
    • Executive summary supported by large image sets
    • SEM cross-sectional and bevel imaging
    • TEM cross-sectional with TEM EDS
    • Technical trend/roadmap by technology element
    • Design technology interaction analysis
    • Detailed explanation of process integrations
    • Next node predictions
    • 4 reports/year
  • Trend Analysis - 1 briefing / year
  • Forecasting
  • Q&A

 

 

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