Stay up to date on technology intelligence in IoT Connectivity SoCs
TechInsights’ IoT Connectivity SoC subscription is the ideal solution for leaders who want to base their product roadmaps on hard facts and understand what’s really going on with cutting edge IoT connectivity systems on chips (SoCs).
This subscription-based service is the authoritative and most cost-effective source of reliable and accurate analysis of image sensors in high-volume and high-growth applications including:
Provides facts on IoT connectivity SoCs and the competitive landscape
Enables you to make informed decisions about device designs
Allows you to go to market quicker with best of class products
Empowers you to grow market share and revenue
Available IoT Connectivity SoC competitive technical intelligence reports
TechInsights’ IoT Connectivity SoC subscription product provides tailored technical analysis to help you address the challenges of developing your IoT connectivity SoC product strategy
Projected number of IoT connectivity SoC reports: 120 annually
Basic Floorplan
Includes:
- Annual Target
- 30 summary reports (~30 pages) and hundreds of high-res supporting images
- Analysis Coverage
- Top metal and polysilicon die images (in CircuitVisionTM)
- Process proof
- Floorplan analysis on die utilization
- Block sizes and functionality
- Die cost
- Analyst Curation
- Design Win Tracking
- Tri-Annual Analyst Briefing
- Annual Onsite Workshop
- Real Time Update
- Access to project work in progress before it is completed
- Access to selected exploratory work
RF Architecture
Includes:
- Annual Target
- 10 analysis reports
- Analysis Coverage
- Focus on RF transceiver
- Plan view SEM image sets of target blocks
- High level functional schematics of target blocks
- Real Time Update
- Access to project work in progress before it is completed
- Access to selected exploratory work
Downstream Product Teardown
Includes:
- Costed bill of materials, PCB board images, component images, package images and x-rays, die markings and die corners, and system block diagrams
- Available as custom project, or as annual subscription where 80 teardown analyses will be provided per year
ON-DEMAND WEBINAR RECORDING
Semiconductor industry trends in IoT devices
Internet of things (IoT) devices are transforming the way we live, and are creating tremendous business opportunities for everyone from established hi-tech juggernauts to startup entrepreneurs.
Distinct trends have begun to emerge in IoT device design as the scope of what is considered “IoT” continues to expand.
ON-DEMAND WEBINAR RECORDING
Systems on Chips: Industry trends in IoT
IoT is the best semiconductor industry driver since the emergence of the smartphone. Early IoT devices used multiple chips to deliver a range of functionality; more recent IoT devices employ SoCs by companies like Nordic, MediaTek, Dialog, STMicroelectronics, Qualcomm, etc. In this webinar, we will review the current IoT SoC competitive landscape, and will walk through the design details of some of the world’s leading edge IoT SoCs.
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Recent News and Blogs
Patent Portfolio Management: Effective Strategies and Best Practices in 2020
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TechInsights Confirms Samsung’s true 7LPP process in the Samsung Exynos 990
Last year, Samsung announced the introduction of EUV into their 7LPP process used in the Exynos 9825. Through analysis of the part, we found little difference between their 7LPP process in the 9825 and their 8LPP process in the Exynos 9820. Now, we18Mar
YMTC is China's First Mass Producer of 3D NAND Flash Memory Chips
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Samsung Galaxy S20 Ultra 5G Camera Teardown
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Xiaomi Mi 10 Teardown Analysis
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If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too
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Deep dismantling of Huawei Mate30 Pro 5G: more than 2,000 components from Japan
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Power Integrations Scores OEM Design Win with their PowiGaN Technology
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Toshiba-WD Alliance 3D NAND mass production will use Samsung TCAT process
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DRAM Scaling Challenges Grow
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Comet Lake for desktop will appear around February 2020? Intel CPU roadmap
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Kirin 990 5G core data exposure: 113.31 square millimeters integrated 10.3 billion transistors
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The Apple U1 - Delayering the Chip and Its Possibilities
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TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices
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Qualcomm QTM052 mmWave Antenna Module
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9X Layer 3D NAND Analysis
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Samsung Galaxy S10 5G Teardown
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Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
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3D NAND Metrology Challenges Growing
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Autonomous Vehicles are Driving Innovation
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Siemens patent filings climb, but quality over quantity is the name of the game
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Samsung Galaxy S10+ Teardown
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Webinar: The Mobile Radio Frequency Landscape
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Lenovo Brings the New Snapdragon to Market
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Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
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Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
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Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
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Webinar: Using Technical Evidence to Strengthen Patents
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Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
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Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
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Automotive Patents: Owners, Technologies, and Investigating for EOU
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Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ET Hosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software01Feb
Job Vacancy: VP Finance
Reporting to the CFO, as the VP Finance, you will provide leadership to the Finance team members responsible for the day-to-day accounting, payroll, tax and treasury, reporting, planning, budgeting and statutory filings. You will regulate corporate16Jul
Job Vacancy: Semiconductor Analyst
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Job Vacancy: Sales Executive - EMEA
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Job Vacancy: Senior Technology Analyst - Logic Processors
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