Stay up to date on technology intelligence in IoT Connectivity SoCs
TechInsights’ IoT Connectivity SoC subscription is the ideal solution for leaders who want to base their product roadmaps on hard facts and understand what’s really going on with cutting edge IoT connectivity systems on chips (SoCs).
This subscription-based service is the authoritative and most cost-effective source of reliable and accurate analysis of IoT connectivity SoCs in high-volume and high-growth applications including:
Provides facts on IoT connectivity SoCs and the competitive landscape
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Empowers you to grow market share and revenue
Available IoT Connectivity SoC competitive technical intelligence reports
TechInsights’ IoT Connectivity SoC subscription product provides tailored technical analysis to help you address the challenges of developing your IoT connectivity SoC product strategy
Projected number of IoT connectivity SoC reports: 120 annually
Basic Floorplan
Includes:
- Annual Target
- 30 summary reports (~30 pages) and hundreds of high-res supporting images
- Analysis Coverage
- Top metal and polysilicon die images (in CircuitVisionTM)
- Process proof
- Floorplan analysis on die utilization
- Block sizes and functionality
- Die cost
- Analyst Curation
- Design Win Tracking
- Tri-Annual Analyst Briefing
- Annual Onsite Workshop
- Real Time Update
- Access to project work in progress before it is completed
- Access to selected exploratory work
RF Architecture
Includes:
- Annual Target
- 10 analysis reports
- Analysis Coverage
- Focus on RF transceiver
- Plan view SEM image sets of target blocks
- High level functional schematics of target blocks
- Real Time Update
- Access to project work in progress before it is completed
- Access to selected exploratory work
Downstream Product Teardown
Includes:
- Costed bill of materials, PCB board images, component images, package images and x-rays, die markings and die corners, and system block diagrams
- Available as custom project, or as annual subscription where 80 teardown analyses will be provided per year
ON-DEMAND WEBINAR RECORDING
Semiconductor industry trends in IoT devices
Internet of things (IoT) devices are transforming the way we live, and are creating tremendous business opportunities for everyone from established hi-tech juggernauts to startup entrepreneurs.
Distinct trends have begun to emerge in IoT device design as the scope of what is considered “IoT” continues to expand.
ON-DEMAND WEBINAR RECORDING
Systems on Chips: Industry trends in IoT
IoT is the best semiconductor industry driver since the emergence of the smartphone. Early IoT devices used multiple chips to deliver a range of functionality; more recent IoT devices employ SoCs by companies like Nordic, MediaTek, Dialog, STMicroelectronics, Qualcomm, etc. In this webinar, we will review the current IoT SoC competitive landscape, and will walk through the design details of some of the world’s leading edge IoT SoCs.
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Recent News and Blogs
Webinar: ALD/ALE Process in Commercially Available Logic Devices
ALD/ALE Process in Commercially Available Logic Devices 2018 saw the introduction of a new generation of logic products featuring finFET transistors headlined by Intel with their 10 nm generation microprocessor, followed by TSMC and Samsung towards26Aug
60 years of the Semiconductor industry and its changing patent strategy
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A Review of the Chevy Bolt Powertrain
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Memory Process Webinar: 3D NAND Word Line Pad (WLP)
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Intel’s 10nm Node: Past, Present, and Future – Part 2
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Apple Computers: Transitioning to ARM Chips is Coming Soon
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On Demand Webinar: A Review of the Power Device Ecosystem & IP Landscape for GaN
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Patent Portfolio Management: Effective Strategies and Best Practices in 2020
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Analysis of Qualcomm's Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services
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Looking at the Apple A12Z Bionic System on Chip
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YMTC is China's First Mass Producer of 3D NAND Flash Memory Chips
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Samsung Galaxy S20 Ultra 5G Camera Teardown
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Recent Analysis of Samsung’s Mobile RF Components
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If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too
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In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks
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Apple Is About to Add a Third OLED Supplier
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Huawei Mate 30 Pro 5G Teardown
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The Evolution of SiC MOSFET Technology: A Retrospective
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Apple U1 TMKA75 Ultra Wideband (UWB) Chip Analysis
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SK hynix 96L 3D PUC NAND Analysis
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Inside the Apple 1720 Charger included with the iPhone 11 Pro Max
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TechInsights Analyses iPhone 11 Cameras
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Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
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Apple iPhone 11 Pro Max Teardown
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Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered
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Peloton IPO Preview: All Hype, No Muscle
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Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo
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A high-end mobile phone sells almost three times what it costs to manufacture it
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Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you
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Why I keep writing ’bout holes in the sensor
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Deca Technologies Fan-In WLP in Qualcomm PM8150
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GaN, SiC, and Si technologies in AC Adapters
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Unexpected Design Wins in Huawei Mate 20 X (5G) Teardown
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Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)
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Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)
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Velodyne LiDAR Puck Teardown
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Part 2: Pixel Scaling and Scaling Enablers
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AC Adapters: GaN, SiC or Si?
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Part 1: Chip-stacking and chip-to-chip interconnect
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Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
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1y DDR4 DRAM from Samsung, SK hynix and Micron
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How long can Sony keep the top spot in the image sensor market?
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Qualcomm QTM052 mmWave Antenna Module
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NAND technology: Open the gates
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Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
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Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.22Apr
TechInsights memory technology update from IEDM18
Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees11Apr
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L10Apr
Samsung Galaxy S10 5G Teardown
Posted: April 9, 2019 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the world09Apr
Analyzing innovations in mobile radio frequency front-end integration
Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support09Apr
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this09Apr
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due09Apr
Autonomous Vehicles are Driving Innovation
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.29Mar
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...25Mar
Samsung Galaxy S10+ Teardown
Posted: March 1, 2019 Contributing Authors: Michelle Alarcon, Daniel Yang, Stacy Wegner, Albert Cowsky We got the new Samsung Galaxy S10+ a little early! TechInsights received the Exynos Samsung Galaxy S10+ SM-G975F/DS from Korea and it has been in01Mar
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve27Feb
Lenovo Brings the New Snapdragon to Market
Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell20Feb
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to07Feb
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and07Feb
Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can12Dec
Webinar: Using Technical Evidence to Strengthen Patents
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it23Oct
Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –04Oct
Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming18Sep
Automotive Patents: Owners, Technologies, and Investigating for EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of11Jul
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software01Feb
Job Vacancy: VP Finance
Reporting to the CFO, as the VP Finance, you will provide leadership to the Finance team members responsible for the day-to-day accounting, payroll, tax and treasury, reporting, planning, budgeting and statutory filings. You will regulate corporate16Jul
Job Vacancy: Semiconductor Analyst
The Semiconductor Analyst will participate in major campaigns and projects initiated client-facing team, and related to analysis of devices manufactured with advanced semiconductor process technology.03May
Job Vacancy: Sales Executive - EMEA
As a Sales Executive, your mission will be to establish and develop accounts within Europe and be accountable for driving the sales process from initial engagement to close.23Apr
Job Vacancy: Senior Technology Analyst - Logic Processors
In this role, you will drive the technical analysis product roadmap for TechInsights, based on a deep understanding of customer interests and industry direction.17Apr