Stay up to date on technology intelligence in IoT Connectivity SoCs
TechInsights’ IoT Connectivity SoC subscription is the ideal solution for leaders who want to base their product roadmaps on hard facts and understand what’s really going on with cutting edge IoT connectivity systems on chips (SoCs).
This subscription-based service is the authoritative and most cost-effective source of reliable and accurate analysis of image sensors in high-volume and high-growth applications including:
Provides facts on IoT connectivity SoCs and the competitive landscape
Enables you to make informed decisions about device designs
Allows you to go to market quicker with best of class products
Empowers you to grow market share and revenue
Available IoT Connectivity SoC competitive technical intelligence reports
TechInsights’ IoT Connectivity SoC subscription product provides tailored technical analysis to help you address the challenges of developing your IoT connectivity SoC product strategy
Projected number of IoT connectivity SoC reports: 120 annually
Basic Floorplan
Includes:
- Annual Target
- 30 summary reports (~30 pages) and hundreds of high-res supporting images
- Analysis Coverage
- Top metal and polysilicon die images (in CircuitVisionTM)
- Process proof
- Floorplan analysis on die utilization
- Block sizes and functionality
- Die cost
- Analyst Curation
- Design Win Tracking
- Tri-Annual Analyst Briefing
- Annual Onsite Workshop
- Real Time Update
- Access to project work in progress before it is completed
- Access to selected exploratory work
RF Architecture
Includes:
- Annual Target
- 10 analysis reports
- Analysis Coverage
- Focus on RF transceiver
- Plan view SEM image sets of target blocks
- High level functional schematics of target blocks
- Real Time Update
- Access to project work in progress before it is completed
- Access to selected exploratory work
Circuit Analysis
Includes:
- Annual Target
- Each subscriber will pick one target for circuit analysis in coordination with TechInsights
- Analysis Coverage
- Focus on RF transceiver
- Circuit extraction of target blocks
- Plan view SEM image set with full hierarchical schematics of target blocks
Downstream Product Teardown
Includes:
- Costed bill of materials, PCB board images, component images, package images and x-rays, die markings and die corners, and system block diagrams
- Available as custom project, or as annual subscription where 80 teardown analyses will be provided per year
ON-DEMAND WEBINAR RECORDING
Semiconductor industry trends in IoT devices
Internet of things (IoT) devices are transforming the way we live, and are creating tremendous business opportunities for everyone from established hi-tech juggernauts to startup entrepreneurs.
Distinct trends have begun to emerge in IoT device design as the scope of what is considered “IoT” continues to expand.
ON-DEMAND WEBINAR RECORDING
Systems on Chips: Industry trends in IoT
IoT is the best semiconductor industry driver since the emergence of the smartphone. Early IoT devices used multiple chips to deliver a range of functionality; more recent IoT devices employ SoCs by companies like Nordic, MediaTek, Dialog, STMicroelectronics, Qualcomm, etc. In this webinar, we will review the current IoT SoC competitive landscape, and will walk through the design details of some of the world’s leading edge IoT SoCs.
Search our analysis and website
| Related Analysis | Manufacturer | Analysis Type | Subscription Channel |
|---|---|---|---|
| HiSilicon Kirin A1 Basic Floorplan Analysis Report | HiSilicon Technologies Co. Ltd | Floorplan | IoT - Basic Functional Analysis |
| Analyst Briefing: IoT - Circuit Vision - T1 2019 | Circuit | IoT - Circuit Analysis | |
| Broadcom wi-fi 6/BT 5.0 wireless Basic Functional Analysis Report | Broadcom | Floorplan | IoT - Basic Functional Analysis |
| NXP Semiconductors SN200 Secure NFC Basic Floorplan Analysis | NXP Semiconductors | Floorplan | IoT - Basic Functional Analysis |
| Apple U1 (TMKA75 Die) UWB SoC Basic Floorplan Analysis | Universal Scientific Industrial | Floorplan | IoT - Basic Functional Analysis |
| Intel WCSAX200 Wi-Fi 6 Chip Basic Floorplan Analysis | Intel | Floorplan | IoT - Basic Functional Analysis |
| Nordic Semiconductor nRF52811 Bluetooth 5.1 Direction Finding SoC Basic Floorplan Analysis | Nordic | Floorplan | IoT - Basic Functional Analysis |
| Toshiba TC35681 Bluetooth SoC Basic Floorplan Analysis | Toshiba | Floorplan | IoT - Basic Functional Analysis |
| Dialog Semiconductor DA14699 Bluetooth Basic Functional Analysis | Dialog Semiconductor | Floorplan | IoT - Basic Functional Analysis |
| Bestechnic BES2300 Bluetooth 5.0 Audio Chip Basic Floorplan Analysis | Bestechnic | Floorplan | IoT - Basic Functional Analysis |
Recent News and Blogs
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Kirin 990 5G core data exposure: 113.31 square millimeters integrated 10.3 billion transistors
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The Apple U1 - Delayering the Chip and Its Possibilities
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Intel Core i7-1065G7 “Ice Lake” 10 nm 2nd Gen Processor Analysis
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Apple U1 TMKA75 Ultra Wideband (UWB) Chip Analysis
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SK hynix 96L 3D PUC NAND Analysis
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Inside the Apple 1720 Charger included with the iPhone 11 Pro Max
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TechInsights Analyses iPhone 11 Cameras
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Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
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Apple iPhone 11 Pro Max Teardown
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Patent licensing: The patent battleplan
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Webinar: Preparing to License: Using tools to Scale Your Licensing Program
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Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered
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How Graphical Solutions Improve 3D NAND Effective Device Density
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Webinar: Power Semiconductor – A Market Overview & In-depth SiC and GaN Device Analysis
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Lithium, the white gold of technology
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A high-end mobile phone sells almost three times what it costs to manufacture it
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Why I keep writing ’bout holes in the sensor
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Deca Technologies Fan-In WLP in Qualcomm PM8150
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GaN, SiC, and Si technologies in AC Adapters
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Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)
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Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)
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Part 1: Chip-stacking and chip-to-chip interconnect
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Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
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1y DDR4 DRAM from Samsung, SK hynix and Micron
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How long can Sony keep the top spot in the image sensor market?
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Qualcomm QTM052 mmWave Antenna Module
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NAND technology: Open the gates
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Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
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Electric Cars Gain Traction, But Challenges Remain
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TechInsights memory technology update from IEDM18
Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees11Apr
9X Layer 3D NAND Analysis
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Samsung Galaxy S10 5G Teardown
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Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
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3D NAND Metrology Challenges Growing
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Autonomous Vehicles are Driving Innovation
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Webinar: The Mobile Radio Frequency Landscape
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Lenovo Brings the New Snapdragon to Market
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Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
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Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
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Webinar: Using Technical Evidence to Strengthen Patents
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Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
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Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
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Automotive Patents: Owners, Technologies, and Investigating for EOU
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Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
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Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
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What does Uber’s patent landscape look like?
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Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
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IP Dealmakers Forum
November 12 – 14 – IP Dealmakers Forum- New York, New York - TechInsights is proud to be a silver sponsor at the 6 th annual IP Dealmakers Forum in New York City. Jason Abt will be a panellist on the “Establishing IP Values: Trends, Tips & Techniques12Nov
IAM IoT IP Europe
November 20 th - IAM IoT IP Europe – Munich, Germany - TechInsights is a gold sponsor at this event with Ian MacLean speaking on the “ Win-win licensing” panel.20Nov
Job Vacancy: VP Finance
Reporting to the CFO, as the VP Finance, you will provide leadership to the Finance team members responsible for the day-to-day accounting, payroll, tax and treasury, reporting, planning, budgeting and statutory filings. You will regulate corporate16Jul
Job Vacancy: Semiconductor Analyst
The Semiconductor Analyst will participate in major campaigns and projects initiated client-facing team, and related to analysis of devices manufactured with advanced semiconductor process technology.03May
Job Vacancy: Sales Executive - EMEA
As a Sales Executive, your mission will be to establish and develop accounts within Europe and be accountable for driving the sales process from initial engagement to close.23Apr
Job Vacancy: Senior Technology Analyst - Logic Processors
In this role, you will drive the technical analysis product roadmap for TechInsights, based on a deep understanding of customer interests and industry direction.17Apr
IEDM Conference
December 7 th – 11 th – IEDM Conference – San Francisco, California - TechInsights will be exhibiting at the 65 th International Electron Devices Meeting.07Dec