Test Connectivity Systems

Semiconductor Test Connectivity System Reports

Semiconductor test connectivity systems are the products that enable electrical connections to be made between the tester and the device being tested. TechInsights has been providing reports on this sector of the semiconductor industry for over 20 years. We have extensive data sets and a deep understanding of how this industry works.

Data and commentary in the reports show what's happening, why, and how this is likely to affect your business whether you are a supplier, buyer, or investor.

Our analysts travel extensively to conferences and trade shows, and to visit the factories and offices of key players so that we can deliver the best quality of data and insights to our clients.

The Probe Card Report

Excel format

Annual and quarterly updates

Dedicated analyst and support

Probe card technologies covered:

Blade/Tungsten
Epoxy/Cantilever
Vertical
MEMS
Other Probe Card Technologies

Markets by application:

DRAM
NAND
NOR
Other Memory
CMOS Image Sensor

High Voltage
Parametric
RF
SOC, CPU, GPU, etc.
Other non-memory

Regions

China, Europe, Japan, Korea, North America, Taiwan, and Rest of World

Other information:

Vendor shares by probe card technology
Probe cards for WLCSP applications
Probe cards by connection type: pad, bump and pillar
Probe cards for flat panel display
Semiconductor revenues and units by device type
Space transformers, guide plates and probe needles
Industry characteristics

The Test and Burn-in Socket Market Report

Excel format

Annual and quarterly updates

Dedicated analyst and support

Products covered:

Test sockets
Burn-in sockets

Markets by package type:

Through hole mount
Surface Mount
Other

Markets by application:

Memory
CMOS Image Sensor
High Voltage
RF
SOC, CPU, GPU, etc.
Other non-memory

Regions

China, Europe, Japan, Korea, North America, Taiwan, and Rest of World

Other information:

Vendor shares - test sockets
Vendor shares - burn-in sockets
Sockets for WLCSP applications
Engineering sockets vs. high volume manufacturing sockets
Sockets by pin type: pogo, elastomer, rigid/other
Semiconductor revenues and units by device type Industry characteristics

The Device Interface Board Report

Excel format

Annual and quarterly updates

Dedicated analyst and support

Device interface board segments:

Board design
PCB manufacture

Markets by application:

Memory
Computing
Communications
Consumer
Automotive
Other

Regions

China, Europe, Japan, Korea, North America, Taiwan, and Rest of World

Other information:

Vendor shares - board designs
Vendor shares - PCB manufacture
Vendor shares - board design and PCB manufacture
Design market - captive vs. merchant
Semiconductor revenues and units by device type
Semiconductor designs
Industry characteristics

Available Semiconductor Market Analysis

Chip Market Research

Chip Market Research Services is a modular strategic planning, marketing, and communication tool that spans the semiconductor manufacturing industry.

The Chip Insider® provides strategic and tactical insights.
The Forecast Pro provides the real-time data a professional analyst needs to predict how trends in the semiconductor business environment will affect their business and investments.
IC Equipment Databases cover market shares with annual and quarterly forecasts for these segments.

Semiconductor Analytics

Semiconductor Analytics is a weekly report addressing the semiconductor supply chain. The research and analysis is end-demand focused and has the objective of providing up-to-date business knowledge. Week-by-week data on electronics and semiconductor demand, along with monthly key performance indicators in electronics and semiconductor application markets are provided to semiconductor suppliers.

Critical Subsystems

Critical Subsystems covers the market on subsystems for semiconductor and related production equipment. These subsystems have been developed to address specific applications and processes within these industries and are dedicated for use on a single tool or process chamber. They perform a particular function in the following key technology areas: Fluid Management, Integrated Process Diagnostics, Optical, Process Power, Thermal Management, Vacuum, and Wafer Handling.

Test Connectivity Systems

Annual analytics reports that cover test connectivity markets, suppliers, and key customer trends. They include Probe Card, Test & Burn-in Socket, and Device Interface Board (DIB) market analyses.

Spreadsheets and Reports

Single data spread sheets and reports are derived from subscription services and can be purchased separately. They are ideal for one-time, low cost access to the data. Data sheets and reports are available through the TechInsights Platform.

Research Methodology

The methodology used in compiling information relies heavily on market simulation and consists of several approaches. The basic theme common to all is data triangulation. Wherever possible, we try to box-in an issue from at least three different directions, sometimes more.