Semiconductor Test Connectivity System Reports
Semiconductor test connectivity systems are the products that enable electrical connections to be made between the tester and the device being tested. TechInsights has been providing reports on this sector of the semiconductor industry for over 20 years. We have extensive data sets and a deep understanding of how this industry works.
Data and commentary in the reports show what's happening, why, and how this is likely to affect your business whether you are a supplier, buyer, or investor.
Our analysts travel extensively to conferences and trade shows, and to visit the factories and offices of key players so that we can deliver the best quality of data and insights to our clients.
The Probe Card Report
Excel format
Annual and quarterly updates
Dedicated analyst and support
Probe card technologies covered:
- Blade/Tungsten
- Epoxy/Cantilever
- Vertical
- MEMS
- Other Probe Card Technologies
Markets by application:
- DRAM
- NAND
- NOR
- Other Memory
- CMOS Image Sensor
- High Voltage
- Parametric
- RF
- SOC, CPU, GPU, etc.
- Other non-memory
Regions
- China, Europe, Japan, Korea, North America, Taiwan, and Rest of World
Other information:
- Vendor shares by probe card technology
- Probe cards for WLCSP applications
- Probe cards by connection type: pad, bump and pillar
- Probe cards for flat panel display
- Semiconductor revenues and units by device type
- Space transformers, guide plates and probe needles
- Industry characteristics
The Test and Burn-in Socket Market Report
Excel format
Annual and quarterly updates
Dedicated analyst and support
Products covered:
- Test sockets
- Burn-in sockets
Markets by package type:
- Through hole mount
- Surface Mount
- Other
Markets by application:
- Memory
- CMOS Image Sensor
- High Voltage
- RF
- SOC, CPU, GPU, etc.
- Other non-memory
Regions
- China, Europe, Japan, Korea, North America, Taiwan, and Rest of World
Other information:
- Vendor shares - test sockets
- Vendor shares - burn-in sockets
- Sockets for WLCSP applications
- Engineering sockets vs. high volume manufacturing sockets
- Sockets by pin type: pogo, elastomer, rigid/other
- Semiconductor revenues and units by device type Industry characteristics
The Device Interface Board Report
Excel format
Annual and quarterly updates
Dedicated analyst and support
Device interface board segments:
- Board design
- PCB manufacture
Markets by application:
- Memory
- Computing
- Communications
- Consumer
- Automotive
- Other
Regions
- China, Europe, Japan, Korea, North America, Taiwan, and Rest of World
Other information:
- Vendor shares - board designs
- Vendor shares - PCB manufacture
- Vendor shares - board design and PCB manufacture
- Design market - captive vs. merchant
- Semiconductor revenues and units by device type
- Semiconductor designs
- Industry characteristics
Available Semiconductor Market Analysis
Chip Market Research
Chip Market Research Services is a modular strategic planning, marketing, and communication tool that spans the semiconductor manufacturing industry.
- The Chip Insider® provides strategic and tactical insights.
- The Forecast Pro provides the real-time data a professional analyst needs to predict how trends in the semiconductor business environment will affect their business and investments.
- IC Equipment Databases cover market shares with annual and quarterly forecasts for these segments.
Semiconductor Analytics
Semiconductor Analytics is a weekly report addressing the semiconductor supply chain. The research and analysis is end-demand focused and has the objective of providing up-to-date business knowledge. Week-by-week data on electronics and semiconductor demand, along with monthly key performance indicators in electronics and semiconductor application markets are provided to semiconductor suppliers.
Critical Subsystems
Critical Subsystems covers the market on subsystems for semiconductor and related production equipment. These subsystems have been developed to address specific applications and processes within these industries and are dedicated for use on a single tool or process chamber. They perform a particular function in the following key technology areas: Fluid Management, Integrated Process Diagnostics, Optical, Process Power, Thermal Management, Vacuum, and Wafer Handling.
Test Connectivity Systems
Annual analytics reports that cover test connectivity markets, suppliers, and key customer trends. They include Probe Card, Test & Burn-in Socket, and Device Interface Board (DIB) market analyses.
Spreadsheets and Reports
Single data spread sheets and reports are derived from subscription services and can be purchased separately. They are ideal for one-time, low cost access to the data. Data sheets and reports are available through the TechInsights Platform.
Research Methodology
The methodology used in compiling information relies heavily on market simulation and consists of several approaches. The basic theme common to all is data triangulation. Wherever possible, we try to box-in an issue from at least three different directions, sometimes more.
Latest Posts From Our Blogs

A Trip Down TSMC Memory Lane – Part 3
At the end of Part 2 of the blog we had reached 2009 and the 40-nm generation; which put TSMC out of sync with other companies, who were marketing their 45-nm product. That discrepancy continued with the usual 70% shrink to the next node, 28-nm for TSMC and 32-nm for IDMs such as Intel and IBM.
Memory Technology Trends and Challenges
Recently, TechInsights hosted a Memory webinar where Dr. Jeongdong Choe, Senior Technical Fellow at TechInsights, discussed the latest memory technology trends and challenges for DRAM and NAND devices.
Mobile RF – 2022 Webinar Recap
TechInsights hosted 3 webinars focused on Mobile RF technology and trends to watch for in 2022. With commentary, insights, and predictions from some of the top minds in the Mobile RF landscape, the TechInsights’ subject matter experts discussed who will be the dominant RF players, the different approaches taken to address the increased complexity brought by new standards, and the new antenna modules used by Apple in the iPhone 12 and 13.
Hybrid Bonding Technology - 2023 and beyond
Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.
Join TechInsights’ Leading Market Analysts at the 2023 Mobile World Congress
Leading market and technology analysts from TechInsights will be attending the Mobile World Congress (MWC) in Barcelona, Spain Feb. 27 – Mar. 2, 2023. During the event, our analysts will conduct business meetings, moderate conference sessions, attend briefings and provide media interviews.