Product Code
BFR-2003-802
Release Date
Availability
Published
Product Item Code
ATC-AB1536
Device Manufacturer
Airoha Technology
Device Type
Bluetooth
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Transceiver Floorplan
Airoha Technology AB1536 Bluetooth 5.0 Audio Chipset Basic Floorplan Analysis
This report presents a Basic Floorplan analysis of the Airoha AB1530C and AB2530B dies found inside the Airoha AB1536 component. It features another new Bluetooth audio IC player in the ear buds market, supports Bluetooth 5.0 dual mode, and mainly competes in the Greater China market.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
 

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