Product Code
MFR-2010-803
Release Date
Availability
Published
Product Item Code
MIC-MT61K256M32JE-19
Device Manufacturer
Micron Technology
Device Type
GDDR6X
Subscription
Memory - NAND & DRAM
Channel
Memory - DRAM Floorplan Analysis
Micron MT61K256M32JE-19 1y nm 8 Gb GDDR6X Memory Floorplan Analysis
This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Plan-view SEM micrograph of the die delayered to the WL and BL layers
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in CircuitVision
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
 

Make informed business decisions faster and with greater confidence

Start My Free Trial

 

The authoritative information platform to the semiconductor industry.

Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.