Lightmatter’s Passage substrate is an active photonic interposer for interconnecting chiplets. All the photonic components and supporting electrical circuits reside in a single multi-reticle piece of silicon.
To tackle the largest AI models, Nvidia has designed a processor to feed its powerful new Hopper GPU. Grace has twice the memory bandwidth of any x86 processor and can hold GPT-3 in DRAM.
In the data-center accelerator race, the three-year-old startup has burst from the gate with a chiplet-based design that aims to compete with Nvidia for general-purpose-GPU (GPGPU) cloud computing.
The startup has made progress on its Grai VIP deep-learning accelerator, changing native processing from INT8 to FP16 and adding audio workloads to its target applications.
Meteor Lake will introduce a multidie arrangement using Intel’s silicon-substrate and advanced packaging technologies. This chiplet approach will appear across all PC price tiers beginning late next year.
Renesas has introduced the first embedded processor with a user-programmable RISC-V CPU. Chinese processors are already adopting RISC-V; more will follow in a direct challenge to Arm.
The startup’s unique at-memory architecture targets an eye-popping 30 teraflop/s per watt and 12,000 teraflops in a single card. The second-generation chip is due to sample in 1H23.
The Israeli startup has built a proof-of-concept system for a simple optical neural network, but it will require additional effort to handle commercial AI models.
Broadcom is the first vendor to sample a 51Tbps data-center switch chip. The 5nm device features 100Gbps serdes and port speeds of up to 800G Ethernet.
Functional safety affects an increasing number of chip and IP designs. Vendors are precertifying chips, IP, and tools to make it easier for their customers to achieve certification.
TI has updated its low-cost SoC family with 64-bit CPUs, lower power, and improved security and functional-safety support, enabling it to target automotive as well as industrial applications.
Intel and Micron have developed a revolutionary new memory technology called 3D XPoint, but under the Optane brand it never met expectations as either an SSD or DIMM replacement.
Among flagship-smartphone processors, Google’s first custom design has the largest AI engine but the worst AI performance. In contrast, the Dimensity 9000’s AI engine is the most efficient.
Intel’s eight-laser silicon-photonics research chip could be a breakthrough for copackaged optics. It places the laser array on a silicon chip that can eventually be integrated in the package.
Qualcomm has updated its smartwatch platform with new chip designs. Reduced power enables a visible watch face even when idle; reduced chipset area enables smartwatches that operate globally.