Posted: May 31, 2018
SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time (tPROG), the memory bit density, with 3.55 Gb/mm2, increased 30% from 48L TLC, and it has a double-stack process integration for NAND string.
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