Product Code
AME-1707-802
Release Date
Availability
Published
Product Item Code
SAN-05138_064G
Device Manufacturer
SanDisk
Device Type
NAND Flash
Subscription
Memory - NAND & DRAM
Channel
Memory - Process
SanDisk/Toshiba 64-Layer 256Gb 3D NAND Flash Advanced Memory Essentials Part 1
The Advanced Memory Essentials (AME) deliverable for NAND Flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
  • Downstream product teardown
  • Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
  • SEM bevel through the logic region and NAND flash
  • SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
  • One or Two TEM cross sections, orthogonal to the word and/or bit lines, showing the NAND flash array cells, the lower metals and dielectrics, transistor gates, isolation, and other FEOL features
  • TEM bevel through the NAND flash
The results of TEM-EDS analyses are included in the AME summary document. The AME deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.
 

Make informed business decisions faster and with greater confidence

Start My Free Trial

 

The authoritative information platform to the semiconductor industry.

Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.