Samsung 2nd-gen HBM2 8 Gb TSV die Memory Floorplan Analysis

Product Code
MFR-2103-804
Release Date
Availability
In Creation
Product Item Code
SAM-K4C001K6MX
Device Manufacturer
Samsung
Subscription
Memory - NAND & DRAM
Channel
Memory - DRAM Floorplan Analysis
Report Code
MFR-2103-804
• Samsung HBM2 2nd ver. (Aquabolt) • 8 Gb TSV die with D2y node, a die design different from the 1st ver. (Flarebolt) • 2.4 Gbps (1st ver. 2.0 Gbps)
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