Hynix H27EGLM 48-Layer 3D V3-NAND Flash Advanced Memory Essentials

Product Code
AME-1710-801
Release Date
14/12/2017
Availability
Published
Product Item Code
HYN-H23Q2T8QK6MES-BC
Device Manufacturer
Hynix
Device Type
NAND Flash
Subscription
Memory - NAND & DRAM
Channel
Memory - Process
Report Code
AME-1710-801
The Advanced Memory Essentials (AME) deliverable for NAND flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
  • Downstream product teardown
  • Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
  • SEM bevel through the logic region and NAND flash
  • SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
  • One (or two) TEM cross sections, orthogonal to the word and/or bit lines, showing the NAND flash array cells, lower metals and dielectrics, transistor gates, isolation, and other FEOL features
  • TEM bevel through the NAND flash
The results of TEM-EDS analyses are included in the AME summary document. The AME deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.
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