Led by strong results from Android vendors and resurgent Chinese brands in their domestic market, the global tablet market shipments contracted only 3% in Q1 2024 compared to the year-ago quarter.

AMD plans a second generation of Versal AI Edge devices that integrate more CPUs with a more efficient hardware accelerator to bring more AI inference capability to edge applications.

NVIDIA’s Blackwell pods bring exascale compute to a rack while pushing the power envelope to 120 kW. The DGX GB200 NVL72 pod offers up to 1.44 ExaFLOPS of FP4 performance.

Cadence has updated its Vision DSP line to handle radar data types and instructions. It’s also offering an accelerator for high-FFT workloads such as 4D imaging radar.

Follow-up to the 5 April Chip Insider on the Hualien City earthquake. As predicted in this write-up, so far the earthquake has had no measurable impact. TSMC proved it definitively this time as their people polished the company’s reputation for being the “trusted capacity provider”.

Semiconductor sales increased 1% last week and were up 23% from this time last year. Zooming in on Auto IC, the 13-week MA was flat YoY last week. TechInsights forecasts Auto IC sales will modestly increase 3% to $44 billion in 2024.

NXP’s new S32N55, part of a new S32N processor family and the newly announced CoreRide brand, centralizes core driving functions that are currently implemented in localized ECUs.