Blackwell Pod Brings Exascale to a Rack
NVIDIA’s Blackwell pods bring exascale compute to a rack while pushing the power envelope to 120 kW. The DGX GB200 NVL72 pod offers up to 1.44 ExaFLOPS of FP4 performance.
Vision 4DR Takes On 4D Imaging Radar
Cadence has updated its Vision DSP line to handle radar data types and instructions. It’s also offering an accelerator for high-FFT workloads such as 4D imaging radar.
Apple Vision Pro Teardown
Discover the inner workings of the Apple Vision Pro A2117 with our in-depth teardown analysis. Explore its M2 processor, Micro-OLED display, sensor suite, connectivity options, and spatial audio technology.
The Chip Insider® – Taiwan’s Earthquake: Follow-up
Follow-up to the 5 April Chip Insider on the Hualien City earthquake. As predicted in this write-up, so far the earthquake has had no measurable impact. TSMC proved it definitively this time as their people polished the company’s reputation for being the “trusted capacity provider”.
Auto IC Sales growth muted YoY the week ending April 19, 2024
Semiconductor sales increased 1% last week and were up 23% from this time last year. Zooming in on Auto IC, the 13-week MA was flat YoY last week. TechInsights forecasts Auto IC sales will modestly increase 3% to $44 billion in 2024.
S32N Processors Consolidate ECUs
NXP’s new S32N55, part of a new S32N processor family and the newly announced CoreRide brand, centralizes core driving functions that are currently implemented in localized ECUs.
Exploring Tesla's Full Self-Driving
Embark on a journey with TechInsights as we explore the world of Tesla's advanced Full Self-Driving (FSD) driving capabilities.
Unlocking Insights: SoC Design Analysis Q1 2024 Briefing
This briefing features key innovations in the latest new technologies: TSMC 3 nm and Intel 4 nm, and the disruptive SMIC 7 nm N+2, through the lens of digital gates and standard cell libraries. Discover our latest benchmarking on scaling and transistor density metrics of leading flagship SoCs like the Apple A17, HiSilicon Kirin 9010, and MediaTek Dimensity 9200.
HiSilicon Kirin 9010 Powers the Huawei Pura 70 Ultra
HiSilicon Kirin 9010 Powers the Huawei Pura 70 Ultra Discover the groundbreaking technology behind Huawei's Pura 70 Ultra smartphone, powered by the innovative HiSilicon Kirin 9010 processor. Delve into our in-depth analysis by the TechInsights team, uncovering the intricacies of the processor and
Can AI Microprocessors be Sustainable? New NVIDIA Blackwell Chip Points to a Breakthrough for High Tech Industry
TechInsights’ sustainability tools provide a clearer view of the NVIDIA Blackwell platform’s sustainability, including cradle-to-gate carbon footprint and power consumption, compared to its predecessors.
Global Smartphone Wholesale Revenue: 5-Year Growth Projection
In 2023, global smartphone sell-through wholesale ASP hit a historic high, signaling robust revenue growth potential until 2029, as outlined in TechInsights' "Smartphone Revenues and ASP Forecasts by 88 Countries" report.
Huawei Pura 70 Ultra Teardown
Uncover the secrets of the Huawei Pura Ultra 70 with our in-depth teardown analysis. From the Kirin 9010 chipset to the innovative camera system, learn what sets this device apart.
