KIOXIA/WD BiCS8 218L CBA 3D TLC NAND

Discover the latest Hybrid Bonding technology with the KIOXIA/WD BiCS8 CBA 3D TLC NAND. Analyzed by TechInsights, this innovative device showcases an advanced edge-XDEC floor plan and a sophisticated 2-deck integration.
23Jul

Intel Drops Hyperthreading From New CPU

Intel’s Lion Cove contains significant departures from previous CPU microarchitectures, prioritizing performance efficiency by omitting hyperthreading and other performance-boosting innovations but still manages to deliver a double-digit IPC uplift.
22Jul

Microprocessor Report June 2024 Review

Microsoft’s Copilot+ PC demands saw Qualcomm, Intel and AMD all launch new PC SoCs with advanced NPUs. Intel’s Gaudi 3 will compete with NVIDIA—although only NVIDIA’s previous generation H100. Advanced packaging is a significant industry trend, and AR is a driving force behind new packaging technologies from TSMC seen in the Apple R1, and an experimental SoC from Meta.
22Jul

Apple Vision Pro: Revolutionizing Face ID with TrueDepth Technology

Spatial computing integrates a user’s virtual environment with their physical surroundings, and Apple's Vision Pro achieves this with a suite of advanced sensors. While LiDAR, or Light Detection and Ranging, plays a significant role in mapping the user's space, the TrueDepth camera system adds another layer of depth sensing.
18Jul

Samsung Galaxy Watch 7

Discover the Samsung Galaxy Watch 7 with TechInsights. Explore the latest Exynos W1000 processor, advanced health tracking, AI wellness tools, and our detailed technical analysis.
18Jul

Samsung Exynos W1000 Processor

Get an in-depth first look at the Samsung Exynos W1000 processor in the Galaxy Watch 7 Series. Discover the 3nm gate-all-around process, critical dimensions, and upcoming detailed analyses on TechInsights.
18Jul