In his keynote at Computex 2024 last week, Jensen Huang proclaimed to a cheering crowd, “We are in a new Industrial Revolution.” But his grand strategy is far more encompassing than the vision of the AI Revolution.

In this briefing, foundries and process nodes used to fabricate the devices are identified, and floorplan and layout are discussed including the area allocated to the analog to digital converters, digital processing, and embedded SRAM.

Interest in Windows on Arm (WoA) is at a high point. Microsoft and Arm must take the opportunity to plug the remaining gaps and create a broader WoA ecosystem.

Innovative PVDF/Al2O3 Separator Boosts Amazon Echo Frame 3rd Gen Battery Safety Discover how the Amazon Echo Frame 3rd Gen achieves high energy density and enhanced safety with its innovative PVDF/Al2O3 battery separator. Learn about the design, materials, and performance features that make it a

This briefing delves into the latest developments in emerging non-volatile memories (EM), encompassing products, technology trends, comparisons, and opportunities for devices like STT-MRAM, PCRAM, ReRAM/CBRAM, and FeRAM. It also covers the technology roadmaps and challenges faced by leading EM foundries.

Processor companies are packing more neural processing capability into processors for IoT edge devices. Here’s a look back at several of these that we covered in May.

Meta’s Reality Labs discussed a prototype AR processor at the 2024 ISSCC, fabricated using hybrid bonding as 3D packaging. This improved performance for the trial tasks of hand tracking and image processing.