Product Code
PKG-2006-801
Release Date
Availability
Published
Product Item Code
UNK-M1910F4E_Penta-Rear-Cam
Device Manufacturer
Unknown
Device Type
Camera Module
Subscription
Image Sensor
Channel
Image Sensor - Package Analysis
Samsung S5KHMXSP 108 MP AF/OIS Camera Module Package Analysis Summary
The Samsung S5KHMXSP CMOS image sensor die is stacked on an image signal processor die. The CIS/ISP stacked die is attached to a metal plate through the PWB window, and the die is wire bonded to the PWB. The Samsung HMX is Samsung first 108 MP class mobile camera used in the Xiaomi Mi CC9 Pro rear camera.
The complete Package Analysis (PKG) deliverable includes summary document, listing observed critical dimensions and salient features. The summary is supported by the following unannotated image folders:
  • Downstream product teardown overview
  • Camera module or package photographs
  • Camera module or package cross section
  • SEM-EDS spectra of select features
Die photograph and non-invasive optical photographs of die feature image set
 

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