Samsung S5KHMXSP 108 MP AF/OIS Camera Module Package Analysis Summary

Product Code
PKG-2006-801
Release Date
27/07/2020
Availability
Published
Product Item Code
UNK-M1910F4E_Penta-Rear-Cam
Device Manufacturer
Unknown
Device Type
Camera Module
Subscription
Image Sensor
Channel
Image Sensor - Package Analysis
Report Code
PKG-2006-801
The Samsung S5KHMXSP CMOS image sensor die is stacked on an image signal processor die. The CIS/ISP stacked die is attached to a metal plate through the PWB window, and the die is wire bonded to the PWB. The Samsung HMX is Samsung first 108 MP class mobile camera used in the Xiaomi Mi CC9 Pro rear camera.
TechInsights Library

A unique vault of trusted, accurate data at your fingertips

Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.