This report presents a Digital Functional Analysis of the Broadcom BCM3390 die found inside a customer-supplied Broadcom BCM3390ZRKFSBG component, which is a DOCSIS 3.1 cable modem system-on-chip (SoC), including two orthogonal frequency-division multiplexing (OFDM) downstream channels, two OFDM upstream channels, 32 quadrature amplitude modulation (QAM) downstream channels, and eight QAM upstream channels.

This report contains the following detailed information:

• Package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at levels including fin/STI, gate, contacts, and minimum pitch metals
• Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
• Plan-view optical micrograph of the die delayered to the gate level
• Identification of major functional blocks on a gate level die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and gate level die photographs delivered in the ICWorks Browser
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process