Intel SRH4U Core™ i5-L16G7 Application Processor CPU Die Intel 2nd Generation 10 nm FinFET Process Digital Floorplan Analysis

Product Code

DFR-2007-801

Release Date

02/10/2020

Availability

Published

Product Item Code

INT-SRH4U

Device Manufacturer

Intel

Device Type

Applications Processor

Subscription

Logic

Channel

Logic - Digital Floorplan (IP)

Logic - Digital Floorplan

Intel SRH4U Core™ i5-L16G7 Application Processor CPU Die Intel 2nd Generation 10 nm FinFET Process Digital Floorplan Analysis

This report presents a Digital Floorplan Analysis of the Intel KLF CPU die found inside Intel SRH4U Core i5-L16G7 (formerly Lakefield) processor. The SRH4U were extracted from the Samsung NP767XCM-K01CA and NP767XCM-K01UK Galaxy Book S laptops.

This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including shallow trench isolation (STI), gate, contacts, and minimum pitch metals
Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
Plan-view optical micrograph of the die delayered to the metal gate level
Identification of major functional blocks on a gate level die photograph
Table of functional block sizes and percentage die utilization
High-resolution top metal and gate level die photographs delivered in the CircuitVision software
Cost of die, based on the manufacturing cost analysis of the observed process

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