Availability
Published
Product Code
DFR-2005-802
Release Date
Product Item Code
PIA-SGC67120
Device Manufacturer
Pixelworks
Subscription
Compute
Channel
Logic - Digital Floorplan (IP)
Logic - Digital Floorplan
Pixelworks Iris 5 TSMC 22ULP Digital Floorplan Analysis
This report presents a Digital Floorplan Analysis of the SGC67120 die found inside Pixelworks PX8578 package. ThePX8578 package was torn down from the OPPO Find 2X (model CPH2023) GSM multi-band handset.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including shallow trench isolation (STI), gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the CircuitVision software
  • Cost of die, based on the manufacturing cost analysis of the observed process
 

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