Qualcomm Snapdragon X55 5G (SDX55M) Modem-RF System TSMC N7 FinFET Process Digital Floorplan Analysis

Product Code
DFR-2003-802
Release Date
25/06/2020
Availability
Published
Product Item Code
QUA-SDX55M
Device Manufacturer
Qualcomm
Device Type
RF Module
Subscription
Logic
Channel
Logic - Digital Floorplan
Report Code
DFR-2003-802
This report presents a Digital Functional Analysis of the HG11-PG591-2 die, found inside the Qualcomm 5G SDX55M Modem-RF system package. The SDX55M RF module was extracted from a Xiaomi Mi10 5G smartphone (model M2001 J2C).
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