Product Code
DFR-2002-802
Availability
Published
Product Item Code
QUA-SM7250
Device Manufacturer
Qualcomm
Device Type
Applications Processor
Subscription
Logic
Channel
Logic - Digital Floorplan (IP)
Logic - Digital Floorplan
Qualcomm SM7250 Application Processor Samsung 7 nm (2nd Generation) FinFET Process Digital Floorplan Analysis
This report presents a Digital Functional Analysis of the HG11-PL323-2 die, found inside the Qualcomm 5G SM7250 system-on-chip (SoC) application processor package. The Qualcomm SM7250 package was extracted from the Oppo Reno3 Pro 5G (model PCRM00).
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
- Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
- Plan-view optical micrograph of the die delayered to the metal gate level
- Identification of major functional blocks on a gate level die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and gate level die photographs delivered in the CircuitVision software
- Cost of die based on the process analysis
The authoritative information platform to the semiconductor industry.
Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.
1891 Robertson Rd #500, Nepean, ON K2H 5B7
Copyright © 2024 TechInsights Inc. All rights reserved.