Qualcomm SM7250 Application Processor Samsung 7 nm (2nd Generation) FinFET Process Digital Floorplan Analysis

Product Code
DFR-2002-802
Release Date
15/05/2020
Availability
Published
Product Item Code
QUA-SM7250
Device Manufacturer
Qualcomm
Device Type
Applications Processor
Subscription
Logic
Channel
Logic - Digital Floorplan
Report Code
DFR-2002-802
This report presents a Digital Functional Analysis of the HG11-PL323-2 die, found inside the Qualcomm 5G SM7250 system-on-chip (SoC) application processor package. The Qualcomm SM7250 package was extracted from the Oppo Reno3 Pro 5G (model PCRM00).
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