Product Code
DFR-2002-802
Release Date
Availability
Published
Product Item Code
QUA-SM7250
Device Manufacturer
Qualcomm
Device Type
Applications Processor
Subscription
Logic
Channel
Logic - Digital Floorplan (IP)
Logic - Digital Floorplan
Qualcomm SM7250 Application Processor Samsung 7 nm (2nd Generation) FinFET Process Digital Floorplan Analysis
This report presents a Digital Functional Analysis of the HG11-PL323-2 die, found inside the Qualcomm 5G SM7250 system-on-chip (SoC) application processor package. The Qualcomm SM7250 package was extracted from the Oppo Reno3 Pro 5G (model PCRM00).

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the CircuitVision software
  • Cost of die based on the process analysis
 

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