Die Attach Materials Market Size and Outlook

This chapter from the SEMI Global Semiconductor Packaging Materials Outlook Report delivers in-depth analysis of the global die attach materials market, including market size, supplier market share, and forward-looking forecasts. It covers both unit volumes and revenues, supported by regional market analysis that highlights geographic demand trends and growth opportunities. Forecasts extend through 2028, providing clear insight into how die attach materials demand is expected to evolve with advancing packaging technologies.

Designed for supply-chain managers, procurement teams, marketing managers, and financial analysts, this chapter also examines the key supply-chain, market, and technical trends shaping the die attach materials industry. The analysis supports informed decision-making around sourcing strategies, technology adoption, and competitive positioning in a rapidly evolving semiconductor packaging landscape.