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Competitive Technology Intelligence
Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)
Platform for the Semiconductor Industry
TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics
Intellectual Property
Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products
Latest Posts From Our Blogs
Webinar - Memory Process and Integration Challenges: DRAM & NAND
In this Memory webinar, Dr. Jeongdong Choe will overview and discuss the latest memory technology trends and challenges, focusing on DRAM and NAND devices. Register today!
Correctly Understanding the Intel 4 Scaling Value
Intel recently presented their Intel 4 process innovation at the 2022 VLSI Symposium. They shared quite a bit of information about the new process, as they have done with nodes previously before products were released.
Reverse Engineering the first Silicon-Oxygen Anode battery-based Smartphone
As part of the TechInsights Li-Ion Battery Essentials subscription, we had the opportunity to reverse engineer the Amperex BM55 battery pack found in the Xiaomi Mi 11 Ultra. Xiaomi claims this is the first smartphone to use a Silicon Oxygen Anode based battery.
Webinar: Practical Implementations of Advanced Silicon-based Anode Technology
This webinar discusses the practical implementations of advanced silicon anode technology from Panasonic/Tesla (NCR 21700 cell), ATL (BM55 from the Xiaomi Mi 11 phone) and Sila Technologies (Whoop 4.0 fitness tracker). The session will provide imagery and analysis comparing these industry leaders' anode structures and materials.
DRAM Scaling Trend and Beyond
When it comes to DRAM cell scaling, we refer to the cell pitch trends from Samsung, SK Hynix, and Micron DRAM products, including active, WL, and BL pitches.
We will see a clear scaling trend delay in Logic 3nm?
TechInsights has added the most recent data from our Digital Floorplan Analysis and TechInsights' speculation for TSMC N3 technology that we expect to see in the next 18 months.Latest Report Analysis
Survey Plus Reports include:
- Device Observations
- Analysis Summary
- Major IC Manufacturer Distribution
- RF Block Diagrams
- Main Enclosure material information
- Identify primary ICs and RF Modules such as SAW filters and Duplexers
- ICs and RF Modules categorized by Component Functions
- Provide package and die-size parameters
- Selected die photos
- Information on major sub-assemblies such as cameras and display/touchscreen subsystems
- Price estimates for the ICs and RF Modules
This report presents a basic floorplan analysis (BFR) of the Airoha Technology AB1562A Bluetooth processor extracted from the ISOtunes IT-15 earbuds.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."