![](/sites/default/files/styles/product_featured/public/AME-2103-803.jpg?h=15cabdba&itok=RY7OicSl)
- Downstream product teardown
- Package photographs and X-rays, top metal and polysilicon die photographs
- SEM cross section along the word line (WL) and the bit line (BL) of the 3D NAND array
- TEM cross section along the BL direction (BLD)
- TEM cross section along the WL direction (BLD)
- SEM bevel
- Memory array
- Memory array edge
- Periphery at the polysilicon level
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