Product Code
MFR-2103-804
Release Date
Availability
Published
Product Item Code
SAM-K4C8E1K6MX
Device Manufacturer
Samsung
Device Type
HBM2
Subscription
Memory - NAND & DRAM
Channel
Memory - DRAM Floorplan Analysis
Samsung K4C8E1K6MX 2nd Gen. 8 Gb HBM2 DRAM Memory Floorplan Analysis
This report presents a Memory Floorplan Analysis of the Samsung K4C8E1K6MX die found inside the NVIDIA GA100-883AA-A1 graphics processor, extracted from the NVIDIA A100 graphics card.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
 

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