Product Code
MFR-2103-801
Release Date
Availability
In Creation
Product Item Code
FUJ-MB85AS8MTPF
Device Manufacturer
Fujitsu
Device Type
ReRAM
Subscription
Memory - Embedded & Emerging
Channel
Memory - Embedded & Emerging Floorplan Analysis
Fujitsu 8 Mb 45 nm ReRAM MB85AS8MT Memory Floorplan Analysis
This report presents a Memory Floorplan Analysis of the Fujitsu MB85AS8MT die found inside the MB85AS8MTPF package.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
 

Make informed business decisions faster and with greater confidence

Start My Free Trial

 

The authoritative information platform to the semiconductor industry.

Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.