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Artificial Intelligence
AI's Advancements Spur Surge in Demand for Cutting-Edge Semiconductors
We have met a tipping point when AI is beginning to compete with human intelligence and indeed even replace humans in some specific tasks. This is driving a new market for advanced semiconductors. TechInsights data on AI covers chips to devices to its use in the consumer and enterprise sectors. We can provide an unique insight into this fast moving and dynamic space.

AI Services – Vendor Profiles
Each vendor profile provides a detailed overview of the company and its products, featuring expert analysis and insights on product strengths, potential competitors, customer names, and major design achievements. Additionally, the profiles explore the various business models and monetization strategies used by different vendors in the industry.
Recently Published AI
Report Five Key Trends for Datacenter in 2025
eBook Generative AI in the Telecom Industry
Report Data-Center AI Chip Market – Q1 2024 Update
The Era of Artificial Intelligence is here.
TechInsights provides you with unique end to end insights, from the chips to the devices to its usage.
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TechInsights’ analysis on Artificial Intelligence includes

Digital floorplans & design analyses of the latest advanced AI processors, as well as advanced memory.

Tracking the strategies & roadmaps of the major semiconductor players.

Sizing and tracking the market for server infrastructure & cloud AI.

Sizing the market for consumer devices which incorporate AI, such as autonomous vehicles & smart home electronics.

Practical use cases of generative AI.
TechInsights’ analysis and commentary on AI will provide you with the data and insight you need to answer questions like:
What are the latest innovations in AI?
What is the size of the AI opportunity?
What is the competitive environment?
Who are the key players, and what is their strategy?
What use cases will drive AI uptake?
Explore our Exclusive Themes
Huawei Mate 80 Pro Max Teardown Confirms Kirin 9030 Pro on SMIC N+3
TechInsights’ teardown of the Huawei Mate 80 Pro Max confirms the Kirin 9030 Pro on SMIC’s N+3 process and reveals major upgrades in display, cameras, and connectivity.
2026 Advanced Packaging Outlook Report
Discover the five expectations defining advanced packaging in 2026, including CPO adoption, HBM4 demand, panel and glass scaling, 3D thermal challenges, and chiplets for mobile.
Trump Approves H200 Exports: Impact on NVIDIA, TSMC & HBM
Trump’s approval of H200 exports to China could reshape GPU, packaging, and HBM markets. TechInsights analyzes supply constraints, pricing, and $40–50B demand.




















