Sony PlayStation 5 Pro Teardown
TechInsights' teardown of the Sony PlayStation 5 Pro (CFI-7021) reveals a custom AMD RDNA 3.0 processor, expanded memory, Wi-Fi 7 support, and a detailed BOM comparison with the original PS5.
Discover the latest semiconductor industry insights in Chip Observer May 2025 — from SanDisk’s spin-off and NAND market shifts to AI-driven SoC growth and geopolitical impacts on chip supply chains.
The Oura Ring Gen 4 teardown and cost analysis. Explore key ICs, sensor upgrades, and design efficiencies that drive down build costs compared to competing smart rings like Samsung’s Galaxy Ring.
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