Ambarella CV22 SoC Digital Floorplan Analysis

Product Code

DFR-2104-801

Release Date

14/07/2021

Availability

Published

Product Item Code

AMG-CV22-A1-RH

Device Manufacturer

Ambarella

Device Type

SoC (System-on-Chip)

Subscription

Logic

Channel

Logic - Digital Floorplan

Logic - Digital Floorplan (IP)

Ambarella CV22 SoC Digital Floorplan Analysis

This report presents a Digital Floorplan Analysis of the Ambarella S4LT003X01 die found inside the Ambarella CV22 component. The CV22 package was extracted from the MiniEye A1 dashboard camera.

This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at levels including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
Plan-view optical micrograph of the die delayered to the metal gate level
Identification of major functional blocks on a gate level die photograph
Table of functional block sizes and percentage die utilization
High-resolution top metal and gate level die photographs delivered in the CircuitVision software
Cost of die based on the manufacturing cost analysis of the observed process

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