Everspin STT-MRAM Advanced Memory Essentials

Product Code
Release Date
Product Item Code
Device Manufacturer
Everspin Technologies
Device Type
Memory - Embedded & Emerging
Memory - NAND & DRAM
Memory - Embedded & Emerging Process
Memory - Process
Report Code
The Advanced Memory Essentials (AME) deliverable for ST-MRAM chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
  • Downstream product teardown
  • Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
  • SEM bevel through the logic memory array and peripheral regions
  • SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
  • A single TEM cross section through the MRAM cell and orthogonal to wordlines, showing the MRAM cell, metals and dielectrics, cell transistor gate stack, isolation, and other FEOL features
The results of TEM-EDS analyses are included in the AME summary document. The AME deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.
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