Broadcom BCM56970 StrataXGSTomahawk II TSMC 16FFC FinFET Process Digital Functional Analysis

Product Code
FAR-1809-801
Release Date
14/11/2018
Availability
Published
Product Item Code
BRO-BCM56970A0KFSBG
Device Manufacturer
Broadcom
Device Type
Ethernet Switch
Subscription
Logic
Channel
Logic - Digital Floorplan
Report Code
FAR-1809-801
This report presents a digital functional analysis on the Broadcom BCM56970 StrataXGS Tomahawk II TSMC 16FFC FinFET process.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including fin/STI, gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the CircuitVision software
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