This report presents a Digital Functional Analysis of the BCM56960_2015 die found inside the Broadcom BCM56960B1KFSBG component/package. The Broadcom BCM56960B1KFSBG, launched in Q2 2018, has a common name of StrataXGS Tomahawk Iand is an Ethernet 3.2 Tb data center switch system-on-chip (SoC).

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
• Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
• Plan-view optical micrograph of the die delayered to the metal gate level
• Identification of major functional blocks on a gate level die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and gate level die photographs delivered in ICWorks Browser