The Advanced Memory Essentials (AME) deliverable comprises a concise analyst summary of critical device metrics, TEM-EDS, TEM-EELS results, and salient features supported by the following image folders:
- Downstream product teardown
- Package Photographs and X-rays, and top metal and polysilicon die photographs
- SEM bevel
- SEM cross section along BLs and WLs
- TEM cross section
The AME deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.