This report presents a Digital Functional Analysis of the Intel X2736 die found inside the Intel PMB9943 baseband processor with a modem component. The PMB9943 component is assembled in a multichip FBGA package comprising two dies, the Intel X2736 baseband processor with modem die flip-chip attached to the package printed wiring board (PWB) and a memory die mounted on the back of the X2736 die and wire bonded to the package PWB. This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/STI , gate, contacts and minimum pitch metals
• Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
• Plan-view optical micrograph of the die delayered to polysilicon
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process