Apple M1 Ultra Advanced Packaging

Packaging has become more sophisticated and a differentiator in the overall performance of advanced SoC chipsets. It can significantly impact form factor, helping to miniaturize designs in the multichip package and improve chip-chip RC delay. The Ultra is the first example of a device utilizing InFO-L technology that TechInsights has documented.
08Sep

FitBit Ionic Recall

Unlock the secrets to optimizing smartwatch battery design with our FREE eBook. Dive into battery degradation, Fitbit Ionic's design, and overheating root causes.
24Aug

Xiaomi Poco C40 Teardown

We have identified hundreds of manufacturers throughout the years and are always looking to expand our BoM Database library. So when we heard the Xiaomi Poco C40 would have a new processor from JLQ Technology, the Poco C40 jumped to the top of our list for a Quick Turn Teardown.
23Aug

The Medtronic PillCam SB3: packaging a capsule endoscope

The Medtronic PillCam SB3: packaging a capsule endoscope John Scott-Thomas Endoscopy is a medical procedure that examines the interior of a body using a camera. Common for digestive track imaging, a conventional endoscope uses a tube that is inserted through the mouth (for examination of the
16Aug

Review and Things to Know: Flash Memory Summit 2022

The Flash Memory Summit 2022 conference including an Expo was held at Santa Clara Convention Center (US) last week (Aug. 1 – 4). Many of the industry-leading memory manufacturers and module suppliers exhibited their latest products in flash storage technology. TechInsights is a recurring and popular speaker at FMS.
11Aug