March 10, 2021 Sinjin Dixon-Warren Power Technology GaN USB-C Charger Market Heating Up in 2021 Gallium nitride (GaN) based high power USB chargers for smartphones, tablets and laptops is a growing area in the power electronics market. TechInsights
March 03, 2021 Dr Peter Gammon Power Technology Prospects for Commercial High Voltage Silicon Carbide Devices - a Summary SiC power devices have the potential to reach voltage ratings beyond 30 kV, yet today, SiC chip manufacturers are focussed on
February 19, 2021 Automotive Technology LiDAR 101 – Solid-State and Mechanical LiDARs 2020 has been an exciting year for LiDAR manufacturers. Five LiDAR companies (Velodyne Inc, Luminar Technologies Inc, Innoviz Technologies Ltd, Aeva Inc, and Ouster
February 17, 2021 NAND & DRAM Memory Technology Download the brief Samsung 12Gb D1z LPDDR5 with EUV Lithography Applied After months of waiting, we have seen Samsung Electronics’ applied Extreme Ultraviolet (EUV) lithography technology for D1z DRAM
February 02, 2021 Teardown Disruptive Technology Samsung Galaxy S21 – rival 5 nm solutions, new design wins, and LPDDR5 with 1z EUV? Right from the release announcement, it seemed the Samsung Galaxy S21 flagship phone was going to be a little bit
February 02, 2021 Ziad Shukri A Recap of Samsung’s 108MP Image Sensors In 2019, Samsung introduced the first 108MP image sensor for mobile applications – the S5KHMX with ISOCELL Plus® technology. We first confirmed its use in the rear (wide) cam of
February 02, 2021 Sinjin Dixon-Warren TechInsights Cracks Open the STMicroelectronics MasterGaN2 TechInsights recently completed a full analysis of the STMicroelectronics MasterGaN1. We found that the device contained two identical GaN Systems dies
February 01, 2021 Dick James Intel Shows Early Ponte Vecchio Part Occasionally we will see something in the media that we think worth commenting on, and post as an “In Case You Missed It” (ICYMI) blog. In this case it was a Twitter post by Intel’s
January 12, 2021 John Sullivan HiSilicon’s move towards an antenna to modem solution HiSilicon provides the RF transceiver and mobile SoC for Huawei’s mobile handsets but the RF front end has traditionally been sourced from the usual front end
December 28, 2020 Dick James Intel Launches 2nd-Gen 3D XPoint Memory, Discusses at IEDM On Dec 16th Intel held a " Memory & Storage Moment"" where they announced five new memory and storage products; two Optane™ SSDs, one for data centers, and one
December 21, 2020 Stephen Russell Toshiba Integrated Diode into SiC MOSFET Every silicon carbide (SiC) manufacturer seemingly has their own approach to FET fabrication. Be it planar, trench, JFET, etc. there is no dominant design throughout the
Dick James, Fellow Emeritus Dick James is an almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to
Stacy Wegner, Senior Technology Analyst Stacy Wegner is the Senior Technology Analyst of TechInsights’ Teardown division, responsible for ensuring the highly technical data produced by our analysts is transformed into consumable competitive
Sinjin Dixon-Warren, Senior Process Analyst Sinjin Dixon-Warren is a Senior Process Analyst at TechInsights with over 20 years of experience with semiconductor analysis and is a Subject Matter Expert (SME) for Power Electronics Analysis. He holds a
