KIOXIA FYK8_1T 218L BiCS8 1 Tb QLC 3D NAND Memory Floorplan Analysis
1 Min Read Oct 21, 2025
Uncover the design of STMicroelectronics’ VD55H1 i-ToF sensor with TechInsights’ analysis of its stacked BI technology and ISP die structure.
This report presents a Memory Floorplan Analysis (MFR) of the KIOXIA FYK8_1T die found inside Kingston FS02T08UCT1-89 NAND flash packages. The Kingston FS02T08UCT1-89 is a 272-pin ball grid array (BGA) 2 TB multi-chip package (MCP) that features sixteen 3D NAND dies. The information contained in this report is relevant to:
- Chip Materials and Capital Equipment Suppliers
- Chip Fabrication and Chip Designers
- Downstream Markets
This summary outlines the analysis* found on the TechInsights' Platform.
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